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Production Technologies

Base Material

FR4, FR4 High TG, EGST 23, CTI 400, G30, Thermal Clad, PCL370, Polyimide, Double sided and Multilayers upto 16 Layers

BACK PANELS, PRESSFIT, CONTROLLED IMPEDANCE, BLIND AND BURIED HOLES, BGA-FINE LINE - FINE PITCH, SEQUENTIAL DRILLING, SEQUENTIAL BUILD UP, CONTROLLED DEPTH DRILLING.

Finishing

HAL, CHEMICAL Ni/Au, LEAD FREE HAL, GALVANIC GOLD, CHEMICAL TIN, OSP

Electrical Test

AOI - SMD1 and 2 Side - Flying Probe, QFP, BGA, mBGA
-MAX TEST AREA: 610x610mm
-TEST VOLTAGE RANGE: 10V/25V
-TEST POINTS: upto 64000
-MINIMUM SMD: 0,100mm
-MAX AOI TEST AREA: 597x762mm


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Techboard PCB Design Unit
Techboard Tooling Division
Techboard PCB Fabrication Unit